美國IBM T. J. Watson研究中心研究員劉兌現博士 西安電子科技大學境外講座教授，IEEE Fellow 學術報告會通知

講座名稱：Designs of Organic Package with Embedded Antennas for mmWave Phased-Array Applications

講座時間：2014-12-14, 10:00 am-11:30am

講座地點：主樓II區241（電子工程學院學術報告廳）

講座人：劉兌現博士 (IEEE Fellow, IBM T. J. Watson Research Center)

講座人介紹：

Duixian Liu received the B.S. degree in electrical engineering from Xidian University, Xi’an, China, in 1982, and the M.S. and Ph.D. degrees in electrical engineering from the Ohio State University, Columbus, in 1986 and 1990, respectively.

From 1990 to 1996, he was with Valor Enterprises Inc. Piqua, Ohio, initially as an Electrical Engineer and then as the Chief Engineer, during which time he designed an antenna product line ranging from 3 MHz to 2.4 GHz for the company, a very important factor for the prestigious Presidential “E” Award for Excellence in Exporting in 1994. Since April 1996, he has been with the IBM T. J. Watson Research Center, Yorktown Heights, NY, as a Research Staff Member. He has received three IBM’s Outstanding Technical Achievement Awards and one Corporate Award, the IBM's highest technical award. He was named Master Inventor in 2007. He has edited a book titled Advanced Millimeter-wave Technologies - Antennas, Packaging and Circuits published in 2009 by Wiley. He has authored or coauthored more than 100 journal and conference papers. He received the Best Paper Prize of the 2007 IEEE International Workshop on Antenna technology for “Antenna-in-package in LTCC for 60 GHz Radio,”  IBM Research's 2011 Pat Goldberg Memorial Best Paper Award in Computer Science, Electrical Engineering and Math for “Organic Packages with Embedded Phased-Array Antennas for 60-GHz Wireless Chipsets,” and the 2012 S. A. Schelkunoff Prize Paper Award of the IEEE Antennas and Propagation Society for “Dual Grid Array Antennas in a Thin-Profile Package for Flip-Chip Interconnection to Highly Integrated 60-GHz Radios,”  He has 52 patents issued and 17 patents pending. His research interests are antenna design, EM modeling, chip packaging, digital signal processing, and communications technologies.

Dr. Liu is a Fellow of IEEE, and was an associate editor for the IEEE Transactions on Antennas and Propagation (2005-2013), a Guest Editor for the IEEE Transactions on Antennas & Propagation special issues on Antennas and Propagation Aspects of 60-90 GHz Wireless Communications (October 2009) and Antennas and Propagation at mm- and sub mm-waves (April 2013), the Lead Guest Editor for International Journal of Antennas and Propagation on special issues on Wearable and RFID Antennas (July 2013) and a section editor for an upcoming Springer antenna handbook (2015). He has been an organizer or chair for numerous international conference sessions or special sessions and served as a technical program committee member for many international conferences. He was the general chair of the 2006 IEEE International Workshop on Antenna Technology: Small Antennas and Novel Metamaterials, White Plains, New York. He has served as an external Ph.D. examiner for several universities and external examiner for government organizations on research grants.

講座內容：

There is an increasing demand for low-cost millimeter-wave (mmWave) systems that operate in the 60 and 94 GHz bands for Gbps data rate communication and imaging applications. Typical applications in the 60 GHz band demanding Gbps data rates include wireless gigabit Ethernet and wireless uncompressed high-definition video. Large available spectrums, short wavelengths, and the ability to operate in dusty and foggy conditions have made mmWave frequencies at 94 GHz attractive for high-resolution imaging applications. Many of these systems require phased arrays. Recent advances in silicon technologies have enabled single chip solutions, making these technologies more commercially attractive. However, for the mmWave market to flourish, not only are low-cost devices solutions required, but also low-cost antenna and packaging solutions. The short wavelength at mmWave frequencies allows antennas to be embedded within a package or integrated on a chip. Antenna-in-package solutions have been recognized to have advantages over antenna-on-chip solutions in bandwidth, radiation efficiency, and low cost due to RFIC die area usage. The realization of robust, efficient and broadband mmWave antennas within a multilayer organic (MLO) or LTCC package is challenging due to assembly difficulties, material selection, and manufacturing tolerances. This presentation will discuss these challenges and some solutions.

主辦單位：

西安電子科技大學電子工程學院

天線與微波技術重點實驗室

國際交流與合作處